Investigation of thermal characteristic behavior of rotating packed bed using air-water system

Loading...
Thumbnail Image
Date
2019-10
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
G.B. Pant University of Agriculture and Technology, Pantnagar - 263145 (Uttarakhand)
Abstract
The investigation of thermal characteristic behavior of rotating packed bed has been conducted in a three-tire approach. Initial testing for the feasibility of thermal responses in the device upon varying the mass flow rate and inlet temperature respectively gave the way for next level of investigation. Here in, the fluid’s mass flow rate ratio, fluid’s inlet temperature ratio, packing rotation and porosity were identified as input/ independent parameters; whereas, pressure drop across the packing, water temperature drop, and heat transfer rate are scheduled as the response variables. The computational fluid dynamics approach has been opted for the entire purpose as it proves beneficial in providing data pertaining to intricate locations that would otherwise have not been possible using conventional methods alone. The implementation of central composite rotatable design scheme has been made in order to obtain corresponding range of data for the analysis of independent parameters.Statistical interpretation of the data for significance of effects caused by the independent variables on to the thermal response variables has been discussed. The use of response surface methodology to discern the thermal behavior of rotating packed bed using surface contours has also been attempted. The vivid discussion of main effects and interaction effects plot is elaborately presented. The use of rotating packed bed secures an overall increment of 157% in the value of heat transfer coefficient for approximately the same temperature drop (~8 K) along with the volumetric reduction in packing/ fills, as high as upto 96.5%.These results justify not only the thermal process intensification in rotating packed bed, but also render sufficient encouragement for futuristic use of this device in the domain of heat transfer applications.
Description
Keywords
Citation
Collections