Mechanical and thermal characterization of electronic waste modified epoxy
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Date
2018-08
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G.B. Pant University of Agriculture and Technology, Pantnagar - 263145 (Uttarakhand)
Abstract
In the present thesis work experimental investigation to study mechanical and thermal properties of electronic waste modified epoxy has been done. The composite consisting of electronic waste particle reinforced in epoxy was fabricated using hand lay-up technique. Electronic waste plastic powder from television and keyboard cabinet was used as filler with epoxy matrix. The filler was transformed to micro size particles from grinder using grinding operation. Two million tons of electronic wastes are produced in India annually, thus posing an environmental challenge. Therefore, we have tried to utilize this electronic waste in the field of material science. This work reveals the systematic methodology of fabrication and evaluation of diverse properties of the epoxy based electronic waste reinforced composites. After applying the curing process, epoxy resin – electronic waste composites, with varying electronic waste weight percentages (0%, 2.5%, 5%, 10%) were put to investigation. On the basis of mechanical testing results properties like tensile strength, Compressive strength, impact strength and hardness improved. The cured epoxy composite with 5 weight % electronic waste content was confirmed to be the best of all compositions under this scrutiny which was authenticated by the micro-structural and mechanical tests. Thermal testing showed insignificant changes in degradation temperature with 5% weight of filler being slightly stable. It is concluded that optimum results were found at a particular percentage of 5%. Thus properties have significantly improved for the developed composite as compared to pristine epoxy.
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