CFD simulation of forced convective cooling in microelectronics
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Date
2018-08
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G.B. Pant University of Agriculture and Technology, Pantnagar - 263145 (Uttarakhand)
Abstract
Thermal challenges in microelectronics is perpetually increasing, so various techniques are available in the industry to reduce the thermal challenges, out of which cooling fin arrangements are one of the best technique which is used in the present study. Different models of fins, (such as inline rectangular fin, inline aerodynamic fin, inline inlet rounded fin, inline inlet outlet rounded fin, staggered rectangular fin and staggered inlet rounded fin) placed in a horizontal channel of previous work are simulated for validation of model and modified geometries are proposed (such as staggered inlet outlet rounded fin, staggered triangular fin, staggered parabolic, and double staggered rectangular fin). SIMPLE algorithm is used for pressure velocity coupling and second order upwind scheme is used for discretization of governing equation. Effect of Reynolds number varying from 151 to 1170 on the heat transfer rate, pressure drop, power input and quality factor is investigated for different fin arrangements. From the simulation, it has been found that double staggered fin performs better than other models. For double staggered fin the investigation is carried out for different gaps maintained between two staggered fins i.e. 0.583, 1.166, 1.749, 2.332 and 2.915mm. A gap of 1.749mm for double staggered fin gives the best quality factor than other models which is 46.15% higher as compared to staggered rectangular fin. Performance of various fin geometries is also presented in the thesis.
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